| Chemistry | Single component Silicone |
| Special Properties | Non-cure; Heat Transfer Compound |
| Specific End Application | Power supply,Thermocouples,Power diodes ,Transistors |
| Part A Viscosity | 4000-6000 cPs @30°C |
| Part A Density | 1.9-2.2 g/cc |
| Thermal Conductivity | >0.8 W/mK |
| Dielectric Loss Factor | 7.2 kV/mm |
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