VEEPOXY 502

VEEPOXY 502

Two-component hot-setting epoxy potting / encapsulation system

Technical Datasheet
Chemistry Two component unfilled Epoxy system
Special Properties Good Chemical Resistance; Good Thermal Resistance
Specific End Application Potting and casing of electrical/electronic components; field coil assemblies; instrument transformers
Part A Viscosity A: 400–900 cPs @25°C
Part B Viscosity B: 40–100 cPs @25°C
Mixing Ratio by Weight By weight: 100 : 80
Curing Schedule 1 hour @150°C
Part A Density 1.08–1.25 g/cc
Part B Density 1.01–1.20 g/cc
Hardness Shore D >80

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