| Chemistry | Two component Silicone system |
| Special Properties | UL94 V-0 Compliant; Re-Workability; High Thermal Conductivity |
| Specific End Application | Electrical potting; PCB encapsulation; LED driver potting; cable joining; surge protection device |
| Part A Viscosity | A: 4,000–6,000 cP @25°C (HTC 1.5); 10,000–15,000 cP @25°C (HTC 2.0); 20,000–30,000 cP @25°C (HTC 2.5) |
| Part B Viscosity | B: 8,000–10,000 cP @25°C (HTC 1.5); 15,000–20,000 cP @25°C (HTC 2.0); 35,000–45,000 cP @25°C (HTC 2.5) |
| Mixing Ratio by Weight | By weight: 100 : 100 |
| Specific Gravity | A/B density: 2.6–2.8 g/cc (HTC 1.5); 2.7–2.9 g/cc (HTC 2.0); 2.8–3.0 g/cc (HTC 2.5) |
| Hardness Shore A | 70–80 |
| Gel Time | 40–60 min @25°C |
| Thermal Conductivity | 1.5–2.5 W/mK |
Veeyor Polymers is a leading manufacturer of high-performance polymer solutions
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